Following information are also available. If you have any interest, please contactc
- Basic Principle of a Scanning Acoustic Tomograph
- Bonding face of a power device (IGBT)
- Cracks and disbonding in an IC card
- High magnification image of an IC card (using high-frequency probe)
- Silicon wafer bonding
- Observing CSP-BGA solder balls
- Liquid crystal flexible substrate
- Disbonding between layers of a laminated ceramic capacitor (chip capacitor)
- Artificial defects in a ceramic capacitor
- Surface of aluminum plates spot-welded using a YAG laser
- Disbonding in a CFRP laminated plate
- Observing resin filler
- Dispersion and cohesion of the filler in the resin
- Resin flow
- Cracks in a thermally sprayed film and inclusions in a steel sheet
- Sound velocity table
