Measurement & Diagnosis
Internal voids, delaminations and cracks in semiconductor devices such as QFP or TSOP can be inspected in non-destructive manner, and the inspection results can be output in image form. Furthermore, automatic Pass/Reject screening can be performed by digitalizing the results to binary data.
S-Image (TM) sets the focus position on the sample surface at start of the scan, and moves down the focus position at each scan to generate a diagonal multi-focus image of the specimen. By simply selecting the brightest position of the inspection target where the focus is on the layer, correct focus position can be set.
The function enables to generate up to 32 images of different layers with pre-set auto focusing function.
Image Index TM is a menu all the image setup parameters can be saved with the generated image, which facilitates data management and re-measurement.
Ultrasonic waveform at user-specified position on the image can be saved and displayed on this screen. Besides, waveform can be enlarged for detail analysis by simply dragging the target waveform area with a mouse.
Delamination assessment can be performed by processing a waveform data at the user-pointed cursor position on the image. Furthermore, Polarity Comparison Image (PCM TM (PAT)) and binary image can be displayed based on the waveform data of the image.
The image can be zoomed in and out in real time.
Multiple waveform windows and cross sectional images can be shown in one inspection result, which makes analysis and creation of inspection report easy.
Two pieces of information out of Depth, Absolute amplitude, positive and negative polarity can be selected to generate a 3D image.
Image Index (TM) is a menu for saving all the inspection parameters together with the generated image. By simply selecting a desired Image Index (TM) to read set values, data management and re-measurement can be carried out with ease. (PAT.)
Both echo level and time-of-flight information can be displayed. Depth of voids and shape of cracks can be clearly observed in this image.
S-image (TM) （PAT.） allows simple focus operation. Click and select intended depth position on multi-focus S-image (TM); focus position is then set and allows quick inspection. Click an image to demonstrate image generation with S-Image (TM) function The demonstration shows [Image Index (TM) screen] - [Parameter Setting screen] - [Multi-Focus S-Image (TM) screen] - [Image center adjustment].
Reflection method is an inspection which ultrasonic probe will transmit and receive the ultrasonic wave reflected from the inspection sample. The intensity of reflected ultrasonic wave will be generated into a plane image. This method has advantage on the image resolution over other inspection methods. Also this method can receive the depth information.
Through Transmission method is a method similar to X-ray inspection, which transmits ultrasonic wave from one side of the specimen, receives it at the other side and create an image according to its reception energy. This method enables to inspect multi-layer structure at one time although the resolution of image is inferior compared to the reflection method.
Area ratio of defects in the user specified dimensions (any area and shape on an image) is calculated.
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